What We Do.
AML design and manufacture integrated Wafer Bonding systems, including the unique capability for in-situ alignment of the wafers immediately prior to bonding.
The aligner-bonder systems are readily configured to meet customer requirements and AML are receptive to discussing design modifications and to provide guidance on process development.
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Innovation.
The AWB systems provide outstanding flexibility and offer the capabilities for a wide range of bonding techniques. The systems are ideally-suited to process development and also enable high-yield bonding in production.
AML worldwide.
Note: Business with Russia is currently suspended
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Did you know?
AML supplies integrated Aligner Wafer Bonder equipment to a global market, with systems in operation across the USA, Asia and Europe.