What We Do.
AML design and manufacture integrated Wafer Bonding systems, including the unique capability for in-situ alignment of the wafers immediately prior to bonding.
The aligner-bonder systems are readily configured to meet customer requirements and AML are receptive to discussing design modifications and to provide guidance on process development.
The AWB systems provide outstanding flexibility and offer the capabilities for a wide range of bonding techniques. The systems are ideally-suited to process development and also enable high-yield bonding in production.
Note: Business with Russia is currently suspended
Did you know?
AML supplies integrated Aligner Wafer Bonder equipment to a global market, with systems in operation across the USA, Asia and Europe.