Why Rock?
The Rock Aligner Bonders are designed for bonding under Ultra High Vacuum conditions, in the 10-8 mbar range.
The Rock systems offer the same aligning and bonding capabilities as the AWB systems, and the UHV vacuum levels are achieved through the use of fully-integrated Cryopump.
Configurations.
FOR 3", 4" & 6" WAFERS + CUSTOM CHIPS
ROCK 04
FOR 6" & 8" WAFERS
ROCK 08
System schematic.
The diagram below is a representation of the components within the ROCK chamber.
![](https://aml.co.uk/wp-content/uploads/2022/10/AWB_Internals_small.png)
Key features of the ROCK.
In-situ alignment, independent wafer heating and radical activation are amongst many valuable features offered by the system, together with enhanced vacuum levels.
![uwc_feature](https://aml.co.uk/wp-content/uploads/2023/06/uwc_feature.jpg#1253)
Edge Clamping ensures no contact with bonding surfaces and eliminates the risk of contamination or damage.
![pressure_feature](https://aml.co.uk/wp-content/uploads/2023/06/pressure_feature.jpg#1258)
Bonding under vacuum or controlled pressure in the range 2.5 x 10-3 mbar and 2 bar absolute. Up to three process gas lines are available.
![force_feature](https://aml.co.uk/wp-content/uploads/2023/06/force_feature.jpg#1255)
Motorised Z control to apply contact forces of up to 40kN.
![tst_features](https://aml.co.uk/wp-content/uploads/2023/06/tst_features.jpg#1256)
Triple-stack anodic bonding of both combinations: silicon-glass-silicon and glass-silicon-glass is possible.
![uv_curing_02](https://aml.co.uk/wp-content/uploads/2023/06/uv_curing_02.jpg#1124)
Optional components for UV cure adhesive bonding are available.
![NIR](https://aml.co.uk/wp-content/uploads/2023/05/NIR.jpg#1019)
Optional NIR cameras sensitive beyond 1.1μm wavelength can replace the standard cameras if required.
![chip_bonding](https://aml.co.uk/wp-content/uploads/2023/06/chip_bonding.jpg#1121)
A special upper platen for mounting of a chip can be offered. Custom size chips can be accommodated.
Did you know?
All AML systems are very flexible and switching between wafer sizes is a straightforward operation, with replacement of the platens taking less than an hour.