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Welcome to AML.
APPLIED MICROENGINEERING LTD.
With long experience and expertise in wafer bonding, AML supply integrated aligner-bonder equipment to a global market.
Applied Microengineering Ltd (AML) design and manufacture wafer-bonding systems with integrated wafer-to-wafer alignment capabilities. The AWB and ROCK systems offer exceptional flexibility, enabling a wide range of bonding techniques to be carried out with in-situ optical alignment. The systems can be readily configured to meet customer requirements.
All AWB & ROCK aligner-bonder systems are constructed at our Harwell Campus facilities, with factory testing, including wafer bonding, carried out within a cleanroom environment.
AML have built an enviable reputation for proven machine reliability and customer support, and remain committed to maintaining a position at the forefront of wafer bonding technology.
AML are based in Oxfordshire, in the UK, with convenient rail/road links to London and Heathrow airport.
Applied Microengineering Ltd specializes in the design and manufacture of Aligner Wafer Bonders.
The AWB system provides the flexibility to enable all types of bonding process to be carried out
The ROCK system features an integrated cryopump for vacuum levels in the 10-8 mbar range
Customise your bonder by choosing the options that suit your application, and request a quote
The AWB and ROCK aligner-bonder systems are versatile and, with in-situ alignment and surface activation capabilities, are ideally suited to R&D or commercial production via automatic recipes
AML aligner-bonder systems enable a wide range of bonding techniques to be carried out, either under manual control or automatic control via programmable recipes, including automatic alignment.
Anodic bonding is a method of hermetically and permanently joining glass to silicon without using adhesives.
Two flat, highly polished clean surfaces will stick together if they are brought into contact. Bond suitable for high/low temp.
Metal Layer Bonding
Various methods of bonding using metal interlayers: Thermocompression, Eutectic, and Solid Liquid Interdiffusion (SLID).
Various adhesives (epoxies, silicones, photoresists, polyimides, BCB, etc.) can be used to form wafer bonds.
Low melting point glasses have been used in industry for many decades to form hermetic seals.
A combination of direct bonding of dielectric SiO2–SiO2 and thermo compression bonding of Cu-Cu metal.
30 Years of Innovation!
AML recently celebrated 30 years serving the MEMS and wafer bonding industry
AML will be attending the ECS 244th meeting
October 8-12th, 2023, booth 121