for IC, MEMS, Compound, Semiconductor & PV Industries
Wafer-Level Packaging Symposium San Jose, CA, February 15-17th 2022. We look forward to seeing you at our Booth. SEMICON CHINA 2022 - Shanghai, March 23-25th 2022. We look forward to meeting you, and to discussing how AML can assist you with your bonding requirements. AML PRODUCTION SYSTEMS Although widely acknowledged that AML aligner wafer bonders are the optimal choice for R&D, due to the outstanding flexibility and functionality offered, AML systems are also used in commercial production. Examples of companies using AML Bonders for production include: Opsens, Emerson Automation, Micross Components, ISSYS, TE Connectivity, Compound Photonics, Matthews International, Endress & Hauser, SITAR, SILAN, Silicon Microstructures, MEMS Solutions, Meteor, Rakon...
Wafer Bonding Service enquiry form
The complete package - off the shelf or custom machines bonding process know how and support from our Bondcentre...
AML manufactures unique in-situ Aligned Wafer Bonding systems, and provides services based around wafer bonding at its state-of-the-art multi-million pound Bondcentre facility situated on the UK’s premiere Science Park in Harwell, Oxfordshire.
AML’s unique Aligned Wafer Bonder systems are the only integrated machines capable of in-situ alignment, activation and bonding on the market. Read more...
For more information on our products & services ring us on +44 (0)1235 833934
AWB-04, AWB-08, NEW "ROCK" Platform and NEW UHV-compatible Bonders
With more than 25 years of experience and expertise, AML is a world leader in the design & manufacture of Wafer Bonding systems offering unique in-situ alignment capabilities. The AWB-04, AWB-08, and 'ROCK' systems form an AWB platform with a number of unique technical and commercial benefits. Read more..
AML’s comprehensive BONDCENTRE facility provides Wafer Bonding process development, applications and demonstration services to support those with the objective of purchasing a System. Read more...
