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Welcome to AML.

APPLIED MICROENGINEERING LTD.

With long experience and expertise in wafer bonding, AML supply integrated aligner-bonder equipment to a global market.

Applied Microengineering Ltd (AML) design and manufacture wafer-bonding systems with integrated wafer-to-wafer alignment capabilities.  The AWB and ROCK systems offer exceptional flexibility, enabling a wide range of bonding techniques to be carried out with in-situ optical alignment.  The systems can be readily configured to meet customer requirements.

About us.

All AWB & ROCK aligner-bonder systems are constructed at our Harwell Campus facilities, with factory testing, including wafer bonding, carried out within a cleanroom environment.

AML have built an enviable reputation for proven machine reliability and customer support, and remain committed to maintaining a position at the forefront of wafer bonding technology.

AML are based in Oxfordshire, in the UK, with convenient rail/road links to London and Heathrow airport.

Our Products.

Applied Microengineering Ltd specializes in the design and manufacture of Aligner Wafer Bonders.

Overview

The AWB and ROCK aligner-bonder systems are versatile and, with in-situ alignment and surface activation capabilities, are ideally suited to R&D or commercial production via automatic recipes

1992

FOUNDED IN


AML has extensive experience in MEMS and wafer bonding processes
365

SUPPORT DAYS/YEAR


We provide customer support direct from the UK and via global agents
25

COUNTRIES


AML supply systems worldwide, and have a strong global presence
1

UNIQUE MACHINE


The only in-situ align & bond system, with unrivalled flexibility

Bond types.

AML aligner-bonder systems enable a wide range of bonding techniques to be carried out, either under manual control or automatic control via programmable recipes, including automatic alignment.

Recent News.

30 Years of Innovation!

AML recently celebrated 30 years serving the MEMS and wafer bonding industry

AML will be exhibiting at Semicon West in San Francisco, 9-11 July 2024

We look forward to meeting you and discussing your bonding requirements!

Some of our clients:

  • University of Sherbrooke