Unique in-situ aligned wafer bonding machines & services
for IC, MEMS, Compound, Semiconductor & PV Industries


AML PRODUCTION TOOLS It is widely acknowledged that AML aligner wafer bonders are the optimal choice for R&D due to their outstanding flexibility & functionality.

It is less well known that many AML systems are used in production!  Just some of the companies using AML Bonders for production: Opsens, Emerson Automation, Micross Components, ISSYS, TE Connectivity, Compound Photonics, Matthews International, Endress & Hauser, SITAR, SILAN, Silicon Microstructures, MEMS Solutions, Meteor, Rakon..  

Recruitment: NO AGENCIES

AML urgently need; Process Development Engineers - some experience of semiconductor processes & or Wafer Bonding. 

Senior Engineering Manager to project manage engineering developments

Equipment engineers: To build, setup, & help develop high tech machines

See our Careers page for details

AWB Flyer

Wafer Bonder enquiry form

Wafer Bonding Service enquiry form


The complete package - off the shelf or custom machines bonding process know how and support from our Bondcentre...

AML manufactures unique in-situ Aligned Wafer Bonding systems, and provides services based around wafer bonding at its state-of-the-art multi-million pound Bondcentre facility situated on the UK’s premiere Science Park in Harwell, Oxfordshire.

AML’s unique Aligned Wafer Bonder systems are the only integrated machines capable of in-situ alignment, activation and bonding on the market.  Read more...


distributors worldwide

For more information on our products & services ring us on +44 (0)1235 833934

AML Machines


AWB-04,  AWB-08,  NEW "ROCK" Platform and NEW UHV-compatible Bonders

With more than 25 years of experience and expertise, AML is a world leader in the design & manufacture of Wafer Bonding systems offering unique in-situ alignment capabilities.  The AWB-04, AWB-08, and 'ROCK' systems form an AWB platform with a number of unique technical and commercial benefits. Read more..

AML’s comprehensive BONDCENTRE facility provides Wafer Bonding process development, applications and demonstration services to support those with the objective of purchasing a System.  Read more...

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