Unique in-situ aligned wafer bonding machines & services
for IC, MEMS, Compound, Semiconductor & PV Industries

WAFERBOND 2022 - University of Schmalkalden, Germany, October 4th - 6th 2022. We look forward to meeting you at WaferBond.

SEMICON CHINA 2022 - Shanghai,    October 5th - 7th 2022.  We look forward to meeting you, and to discussing how AML can assist you with your bonding requirements.

AML PRODUCTION SYSTEMS  Although widely acknowledged that AML aligner wafer bonders are the optimal choice for R&D, due to the outstanding flexibility and functionality offered, AML systems are also used in commercial production.  Examples of companies using AML Bonders for production include: Opsens, Emerson Automation, Micross Components, ISSYS, TE Connectivity, Compound Photonics, Matthews International, Endress & Hauser, SITAR, SILAN, Silicon Microstructures, MEMS Solutions, Meteor, Rakon... 

AWB Flyer

Wafer Bonder enquiry form

Wafer Bonding Service enquiry form


The complete package - off the shelf or custom machines bonding process know how and support from our Bondcentre...

AML manufactures unique in-situ Aligned Wafer Bonding systems, and provides services based around wafer bonding at its state-of-the-art multi-million pound Bondcentre facility situated on the UK’s premiere Science Park in Harwell, Oxfordshire. 

AML’s unique Aligned Wafer Bonder systems are the only integrated machines capable of in-situ alignment, activation and bonding on the market.  Read more...


distributors worldwide

For more information on our products & services ring us on +44 (0)1235 833934

AML Machines


AWB-04,  AWB-08, "ROCK" Platform and NEW UHV-compatible Bonders

With more than 25 years of experience and expertise, AML is a world leader in the design & manufacture of Wafer Bonding systems offering unique in-situ alignment capabilities.  The AWB-04, AWB-08, and 'ROCK' systems form an AWB platform with a number of unique technical and commercial benefits. Read more..

AML’s comprehensive BONDCENTRE facility provides Wafer Bonding process development, applications and demonstration services to support those with the objective of purchasing a System.  Read more...

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