Introduction.

The AWB aligner-bonder provides for complete bonding process control within a single chamber and is ideally-suited to R&D and high-yield production.

The Bonder provides outstanding flexibility and offers the capabilities for a wide range of bonding techniques. It features a unique in-situ, optical wafer-to-wafer alignment system as standard, with 1μm alignment accuracy.

Configurations.


FOR 3", 4" & 6" WAFERS + CUSTOM CHIPS

AWB 04

FOR 6" & 8" WAFERS

AWB 08

System schematic.

The diagram below is a representation of the components within the AWB chamber.

Key features of the AWB.

In-situ alignment, independent wafer heating and radical activation are amongst many valuable features offered by the system.



Did you know?

The system's compact footprint means a minimal cleanroom space requirement.