CS MANTECH

CS MANTECH

EVENT INFORMATION

BOOTH NUMBER: 105

RECENT EVENT:

SEE YOU AT

18-21 MAY, PORTLAND, OREGON

SEMICON CHINA

SEMICON CHINA

EVENT INFORMATION

BOOTH NUMBER: 3123

RECENT EVENT

SEE YOU AT

MARCH 25-27 2026, SHANGHAI, CHINA

SEMICON WEST 2025

SEMICON WEST 2025

RECENT EVENT:

AML Exhibited at Semicon West 2025 in Phoenix, Arizona

BOOTH NUMBER 6077

THANK YOU FOR VISITING US AT THE PHOENIX CONVENTION CENTER, 7–9 OCT 2025

WAFERBOND'25

WAFERBOND'25

EVENT INFORMATION

RECENT EVENT:

GLAD TO SEE YOU AT

IN GERMANY

HARVARD UNIVERSITY

HARVARD UNIVERSITY

AML were delighted to participate in the Harvard Direct Writing and Integration Symposium 2025, held in June, hosted by the Center for Nanoscale Systems (CNS) at Harvard University.

MORE INFORMATION

HOME / UPCOMING EVENTS

DTIP 2026

31.05 - 3.06, PARIS, FRANCE

Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS

DTIP'2026 will be the 28th edition of the Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS. This unique event aims to present the latest research in Design, Test, Integration and Packaging of Sensors, Actuators, Microsystems, MEMS, NEMS and MOEMS. All aspects including design, modeling, testing, micro-machining, integration and packaging of structures, devices and systems will be addressed in a single track Conference. After the successful 2025 edition in Split, the 2026 edition will take place in the city of Paris, France. Meet us in Paris!

Upcoming events will be announced here well in advance. In the meantime, take a look at what you may have missed below:

CS MANTECH

International Conference on Compound Semiconductor Manufacturing Technology.

Portland Marriott Downtown Waterfront
Portland, Oregon
18-21 May, 2026

Semicon China 2026

One of the world’s premier semiconductor exhibitions, is set to bring together leading innovators, suppliers, and industry experts from across the globe.

Shanghai New International Expo Centre
Shanghai, China
March 25-27, 2026

Semicon West 2025

Phoenix is set to become a tech powerhouse in 2025 with the arrival of SEMICON West, the premier microelectronics exhibition in North America.

Phoenix Convention Center
Phoenix, Arizona
October 7-9 2025

WaferBond'25

Conference on Wafer Bonding for Microsystems, 3D and Wafer Level Integration

Hotel Co56
Chemnitz, Germany
December 3-4 2025

Harvard Symposium

AML participated in the Harvard Direct Writing and Integration Symposium 2025, held in June, hosted by the Center for Nanoscale Systems (CNS) at Harvard University.

Center for Nanoscale Systems (CNS)
Cambridge, Massachusetts
June 4-6 2025

Want to meet Us?

Get in touch to arrange a meeting during one of the events if you wish to discuss your requirements in detail.

More About Tony:

After retiring in 2021 from his role as Technical Director, Tony devoted himself to his other passions and embraced writing and performing his poetry and music.

To us, Tony was far more than a colleague or founder – he was a mentor, an inspiration, and a friend. His inquisitive mind was matched by rare compassion, humility, selflessness, and genuine kindness. He taught us that nothing is impossible and that, at least in science, there is always a solution waiting to be found.

Through years of shared projects, countless discussions, and an open exchange of ideas, Tony helped shape not only our professional paths but our personal growth. His trust, guidance, encouragement, and belief in us will always be remembered with gratitude.

Tony will be deeply missed – not only for what he knew, but for who he was. His legacy lives on in the technologies he created and in all of us who will continue to build upon the exceptional foundation he established.

We extend our deepest condolences to Tony’s family and friends.

Multi stack bonding

Thick wafer bonding and multi stack wafer bonding is possible, accommodating up to 30mm thick stacks.

In-situ Chemistry

Various chemistries can be introduced into the chamber using either vapour injection system (DI water or acid) or pressure control system (gas). Wafers held in separation can be treated just before contact, for example for Copper oxide removal.

Efficient Outgassing

Large wafer separation allows more effective evacuation of the space between the wafers. All surfaces of cavities can be efficiently outgassed while the wafers are heated. It is particularly important for vacuum or gas encapsulation.

Independent Heating

Upper and lower wafers can be heated independently to different temperatures and with different ramp rates. The differential temperature can be as high as 350°C (depending on options). This feature can be useful for processes where one wafer needs outgassing while the other one has to stay cold or for activating the getter on one wafer.

AWB Configurator - Request a Quote

- Step 1 of 4
Select your Bonder Type: AWB or ROCK
In addition to all AWB features, the ROCK has UHV capability achieved through a Cryo-Pumping System.
Layout
Select your Platform: *
AWB (10-6mbar range)
ROCK (10-8mbar range)
Click on the pictures to select AWB or ROCK
Pumping System / Vacuum Level *
CryoPumping UHV (10-8 mbar range)
Pumping System / Vacuum Level *
Turbo Molecular Pump (10-6 mbar range)
AWB Wafer / Platen Sizes *
AWB04 (for 3" and 4" Wafers)
AWB04 (for 6" Wafers)
AWB04 (for 3", 4 and 6" Wafers)
AWB08 (for 6" Wafers)
AWB08 (for 8" Wafers)
AWB08 (for 6" and 8" Wafers)
ROCK Wafer / Platen Sizes *
ROCK04 (for 3" and 4" Wafers)
ROCK04 (for 6" Wafers)
ROCK04 (for 3", 4 and 6" Wafers)
ROCK08 (for 6" Wafers)
ROCK08 (for 8" Wafers)
ROCK08 (for 6" and 8" Wafers)
Add Graphite Platens
Upper Graphite Platen
Select this if Anodic bonding is required
Chip Bonding Platens
10mm Wafer Chip Bonding
15mm Wafer Chip Bonding
25mm Wafer Chip Bonding
Other size
Only available for -04 models
Specify custom chip size (mm)
Further Options
Layout
Force Application
40 kN Manipulator - Standard
Chamber Pressure Control
Single Gas Line (Standard)
Two Gas Lines
Three Gas Lines
Vacuum Pumping System
HiPace80 Turbo + MVP-40 Roughing Pump (Standard)
HiPace80 Turbo + ACP-15 Roughing Pump (Enhanced)
HiPace300 Turbo + ACP-15 Roughing Pump (Enhanced)
Vacuum Pumping System
HiPace80 Turbo + ACP-15 Roughing Pump (Standard)
HiPace300 Turbo + ACP-15 Roughing Pump (Enhanced)
Either option is coupled with a Cryogenic Pumping System
Optional Features
RAD (radical activation)
AVI (automatic vapour injection) - required for RAD*
Lower Wafer Clamp
Triple Stack bonding tool (for Anodic bonding)
UV Bonding
Automatic alignment (manual alignment as standard)
Image Capture (for wafer backside alignment)
Near-Infrared Optics (NIR)
Final Details
Anything to add?
Layout
File Upload

Click or drag a file to this area to upload.

Max file size: 5MB. Only PNG, JPG, GIF, DOC, PDF files allowed.
Estimated required installation date: *
Further Information
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We need this so we can get back to you with the Quotation and discuss your application!
Layout
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