Note: Touch the above marks in different areas to simulate alignment. For the best experience, please visit our website from a desktop computer.
Manual & Automatic live in-situ alignment down to 1 µm accuracy
Wafers are aligned using visible or IR illumination, immediately prior to contact & bonding
The live view provides visual confirmation and allows last-minute corrections, ensuring post-bond accuracy. Alignment can be carried out at any desired temperature, eliminating inaccuracies due to thermal expansion and mismatch between wafers. The central pin is used to prevent contact shift.
All in One
Entire bonding process is done in one chamber without physically moving the wafers from aligner to the bonder
Adjust last minute
Possibility of making fine alignment adjustments just before contacting the wafers for bonding
Shorter cycle times – can align while system is being pumped down and wafers heated
Ability to re-align
Corrections possible – in some processes, if alignment at contact is not satisfactory, it’s possible to separate the wafers and start again
Align hot or cold
Can be carried out at any desired temperature, eliminating inaccuracies due to thermal expansion mismatch
No Contact Shift
Good “contact shift” control – alignment observed live while force is being applied to the wafers; also helped by using the central pin
Very useful for adhesive or glass frit bonding where low viscosity materials can be problematic while contacting the wafers
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