Watch the bond happen in real time

Process live view

Benefits.

The ability to observe bond formation in real-time is an important advantage for process development.

The visual information during bonding allows process parameters such as temperature and force to be adjusted as required. This feature can significantly reduce process development time and is particularly useful for interlayer bonding with adhesives, glass frit or metals.

Adhesive Bonding.

Our live view feature enables the user to capture the exact moment of bond formation while heating the wafers. Observing the epoxy flow allows adjusting the bond force and temperature in real time to create a void free seal with the desired bond line spread. This gives much better understanding of the process and easily identifies the parameters that may need further adjustment.

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Did you know?

Live view allows defining the best temperature for alignment of wafers with different CTEs – the user can clearly see how the mismatch changes with temperature.

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Independent Heating

Upper and lower wafers can be heated independently to different temperatures and with different ramp rates. The differential temperature can be as high as 350°C (depending on options). This feature can be useful for processes where one wafer needs outgassing while the other one has to stay cold or for activating the getter on one wafer.

Multi stack bonding

Thick wafer bonding and multi stack wafer bonding is possible, accommodating up to 30mm thick stacks.

In-situ Chemistry

Various chemistries can be introduced into the chamber using either vapour injection system (DI water or acid) or pressure control system (gas). Wafers held in separation can be treated just before contact, for example for Copper oxide removal.

Efficient Outgassing

Large wafer separation allows more effective evacuation of the space between the wafers. All surfaces of cavities can be efficiently outgassed while the wafers are heated. It is particularly important for vacuum or gas encapsulation.

AWB Configurator - Request a Quote

- Step 1 of 4
Select your Bonder Type: AWB or ROCK
In addition to all AWB features, the ROCK has UHV capability achieved through a Cryo-Pumping System.
Layout
Select your Platform: *
AWB (10-6mbar range)
ROCK (10-8mbar range)
Click on the pictures to select AWB or ROCK
Pumping System / Vacuum Level *
CryoPumping UHV (10-8 mbar range)
Pumping System / Vacuum Level *
Turbo Molecular Pump (10-6 mbar range)
AWB Wafer / Platen Sizes *
AWB04 (for 3" and 4" Wafers)
AWB04 (for 6" Wafers)
AWB04 (for 3", 4 and 6" Wafers)
AWB08 (for 6" Wafers)
AWB08 (for 8" Wafers)
AWB08 (for 6" and 8" Wafers)
ROCK Wafer / Platen Sizes *
ROCK04 (for 3" and 4" Wafers)
ROCK04 (for 6" Wafers)
ROCK04 (for 3", 4 and 6" Wafers)
ROCK08 (for 6" Wafers)
ROCK08 (for 8" Wafers)
ROCK08 (for 6" and 8" Wafers)
Add Graphite Platens
Upper Graphite Platen
Select this if Anodic bonding is required
Chip Bonding Platens
10mm Wafer Chip Bonding
15mm Wafer Chip Bonding
25mm Wafer Chip Bonding
Other size
Only available for -04 models
Specify custom chip size (mm)
Further Options
Layout
Force Application
40 kN Manipulator - Standard
Chamber Pressure Control
Single Gas Line (Standard)
Two Gas Lines
Three Gas Lines
Vacuum Pumping System
HiPace80 Turbo + MVP-40 Roughing Pump (Standard)
HiPace80 Turbo + ACP-15 Roughing Pump (Enhanced)
HiPace300 Turbo + ACP-15 Roughing Pump (Enhanced)
Vacuum Pumping System
HiPace80 Turbo + ACP-15 Roughing Pump (Standard)
HiPace300 Turbo + ACP-15 Roughing Pump (Enhanced)
Either option is coupled with a Cryogenic Pumping System
Optional Features
RAD (radical activation)
AVI (automatic vapour injection) - required for RAD*
Lower Wafer Clamp
Triple Stack bonding tool (for Anodic bonding)
UV Bonding
Automatic alignment (manual alignment as standard)
Image Capture (for wafer backside alignment)
Near-Infrared Optics (NIR)
Final Details
Anything to add?
Layout
File Upload

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Max file size: 5MB. Only PNG, JPG, GIF, DOC, PDF files allowed.
Estimated required installation date: *
Further Information
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