Process live view
The ability to observe bond formation in real-time is an important advantage for process development.
The visual information during bonding allows process parameters such as temperature and force to be adjusted as required. This feature can significantly reduce process development time and is particularly useful for interlayer bonding with adhesives, glass frit or metals.
Our live view feature enables the user to capture the exact moment of bond formation while heating the wafers. Observing the epoxy flow allows adjusting the bond force and temperature in real time to create a void free seal with the desired bond line spread. This gives much better understanding of the process and easily identifies the parameters that may need further adjustment.
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