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            Applied Microengineering Ltd.

            +44 1235 833934
            aml@aml.co.uk
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            • Home
            • About AML
              • Who We Are
              • What We Do
              • Meet Our Directors
              • Legal Terms
            • Product Range
              • AWB
              • ROCK
              • AWB Configurator
            • Technical
              • Bonding Techniques
              • Key Features ➔
                • In-Situ Alignment
                • Process Live View
                • Radical Activation
                • Vapour Injection
                • Wafer Separation
            • Contact
            AML_retina_logo
            • Home
            • About AML
              • Who We Are
              • What We Do
              • Meet Our Directors
              • Legal Terms
            • Product Range
              • AWB
              • ROCK
              • AWB Configurator
            • Technical
              • Bonding Techniques
              • Key Features ➔
                • In-Situ Alignment
                • Process Live View
                • Radical Activation
                • Vapour Injection
                • Wafer Separation
            • Contact
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                      Brochure Download

                      Specify your own bonder & request a quotation

                      CLICK HERE

                      AML Headquarters:

                      Unit 8 Library Avenue
                      Harwell Campus, Didcot, Oxfordshire OX11 0SG, UK

                      Company Reg No. 02758741

                       

                      Technical

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                      © 2025 Applied Microengineering Ltd. All Rights Reserved | Created by Robert Popa

                      Independent Heating

                      Upper and lower wafers can be heated independently to different temperatures and with different ramp rates. The differential temperature can be as high as 350°C (depending on options). This feature can be useful for processes where one wafer needs outgassing while the other one has to stay cold or for activating the getter on one wafer.

                      Multi stack bonding

                      Thick wafer bonding and multi stack wafer bonding is possible, accommodating up to 30mm thick stacks.

                      In-situ Chemistry

                      Various chemistries can be introduced into the chamber using either vapour injection system (DI water or acid) or pressure control system (gas). Wafers held in separation can be treated just before contact, for example for Copper oxide removal.

                      Efficient Outgassing

                      Large wafer separation allows more effective evacuation of the space between the wafers. All surfaces of cavities can be efficiently outgassed while the wafers are heated. It is particularly important for vacuum or gas encapsulation.

                      AWB Configurator - Request a Quote
                      - Step 1 of 4

                      Select your Bonder Type: AWB or ROCK

                      In addition to all AWB features, the ROCK has UHV capability achieved through a Cryo-Pumping System.
                      Click on the pictures to select AWB or ROCK
                      Select this if Anodic bonding is required
                      Only available for -04 models

                      Further Options

                      Either option is coupled with a Cryogenic Pumping System

                      Final Details

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