Unique in-situ aligned wafer bonding machines & services
for IC, MEMS, Compound, Semiconductor & PV Industries
 

See us at the following Events

Electrochemical Society Meeting - AiMES 2018 will he held from September 30 – October 4, 2018 in Cancun, Mexico.

Recruitment:

AML urgently need; Electrical/Instrument engineer with Software skills,  Technical sales engineer, Senior Technical, Commercial & General Managers, Equipment Engineers, Mechanical Design Development Engineers, "Boffins", Engineering Technicians.

 

See our Careers page for details

 

 

AWB Flyer

Wafer Bonder enquiry form

Wafer Bonding service enquiry form

 

The complete package - off the shelf or custom machines bonding process know how and support from our Bondcentre...

AML manufactures unique in-situ aligned wafer bonding machines and provides services based around waferbonding in its state-of-the-art multi-million pound Bondcentre facility situated on UK’s premiere science park in Harwell, Oxfordshire.

AML’s unique Aligned Wafer Bonder machines are the only machines capable of in-situ alignment, activation and bonding on the market. Read more...

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distributors worldwide

For more information on our products & services ring us on +44 (0)1235 833934

AML Machines

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NEW "ROCK" Platform

NEW UHV Bonders

The design of our machines has benefited from over 20 years experience of Aligned - Wafer Bonding at AML. Our AWB04, AWB08, and FAB12 machines create an AWB platform with a number of unique technical and commercial benefits. Read more..

AML’s comprehensive BONDCENTRE provides Wafer bonding development, applications & DEMO services to support those with the objective of prchasing a tool only. Read more...

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