Unique in-situ aligned wafer bonding machines & services
for IC, MEMS, Compound, Semiconductor & PV Industries
for IC, MEMS, Compound, Semiconductor & PV Industries
FAB12 Cassette Bonder
FAB12 Cassette Bonders bring the unique benefits of AML aligner bonders to high throughput processing for pilot lines and volume manufacture:
In-situ alignment – simulaneous heating, pumping and alignment gives high throughput in a single bond chamber –no cluster tool required.
- Brooks Automation.
- Wafer Size: 150mm & 200mm (300mm ready).
- Alignment Accuracy 1 micron
- Low Cost of Ownership & Small Footprint.
- SECS/GEM, SECS300 & E84 Compliant.
- Anodic, Eutectic, Direct, Thermocompression, Adhesive and Glass Frit Bonds.
- Options: UV Adhesive Curing, Through-Wall mounting and Class 1 Mini-Environment (Laminar Flow System between cassettes & process chamber).
- Wafer Size 150 & 200mm (300mm ready).
- Wafer Thickness Max Stack Height 6.5mm.
- Wafer Handling 3mm Perimeter Exclusion Zone Contact.
- Max Temperature 560° C.
- Base Pressure 10-6mbar range.
- Pumping Time 5 min (to 10-5mbar).
- Max Bond Force 25kN.
- Number of Cassettes 2 or 3 (FOUP, SMIF or Open Cassette Load Ports).
- Process Gas Ports 4.
- Transparent and opaque wafers.
- Alignment marks on front or back side.
- Options - Class 2 (ISO14644-1) mini environment(Laminar flow unit), UV Curing (Adhesive Bonding) and Through Wall.