FAB12 Cassette Bonder

FAB12 Cassette Bonders bring the unique benefits of AML aligner bonders to high throughput processing for pilot lines and volume manufacture:

• In-situ alignment – simulaneous heating, pumping and alignment gives high throughput in a single bond chamber –no cluster tool required.
• Brooks Automation.
• Wafer Size: 150mm & 200mm (300mm ready).
• Alignment Accuracy 1 micron
• Low Cost of Ownership & Small Footprint.
• SECS/GEM, SECS300 & E84 Compliant.
• Anodic, Eutectic, Direct, Thermocompression, Adhesive and Glass Frit Bonds.
• Options: UV Adhesive Curing, Through-Wall mounting and Class 1 Mini-Environment (Laminar Flow System between cassettes & process chamber).
• Wafer Size 150 & 200mm (300mm ready).
• Wafer Thickness Max Stack Height 6.5mm.
• Wafer Handling 3mm Perimeter Exclusion Zone Contact.
• Max Temperature 560° C.
• Base Pressure 10-6mbar range.
• Pumping Time 5 min (to 10-5mbar).
• Max Bond Force 25kN.
• Number of Cassettes 2 or 3 (FOUP, SMIF or Open Cassette Load Ports).
• Process Gas Ports 4.
• Transparent and opaque wafers.
• Alignment marks on front or back side.
• Options - Class 2 (ISO14644-1) mini environment(Laminar flow unit), UV Curing (Adhesive Bonding) and Through Wall.

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