Unique in-situ aligned wafer bonding machines & services
for IC, MEMS, Compound, Semiconductor & PV Industries
 



Embosser

The AWB-04 and 08 platforms can also perform Hot Polymer embossing without any further tooling. The master is held in the upper platen and the polymer substrate is held on the lower platen – the two are brought into contact ton perform the embossing function.

 

Applications:

Bio-Sensors, Microfluidics & Polymer Electronics
Polymrs: SU8, PDMS, PMMA, PEEK

The tool can either be a dedicated, stand alone emboss / imprint machine, or can be an optional attachment to standard AML bonding machines.

In either case the emboss mechanism is mounted on the lid of the process chamber. This chamber can either be evacuated or pressurised. The emboss / print stamp is attached to an upper platen that is capable of being heated to 560 deg C. The work piece wafer is mounted on a lower platen that has similar heating capability.

The lower platen can be moved in X,Y,Z and Ø, to enable precision contacting of the stamp with the work piece. The alignment is achieved in a similar fashion to mask aligners, and the stamp / work piece need to have alignment marks processed onto them. These marks are imaged using externally mounted cameras. Either visible reflected light or transmitted IR can be used depending on the optical characteristics of the materials being used. A feature of the machine is the true straight line movement in the Z direction. This enables the precision for nano-imprinting, and, when combined with the long stroke, the formation of high aspect ratio embossed structures.

The emboss / print procedure is as follows:

  • Mount wafers on platens
  • Close lid.
  • Pump down chamber and simultaneously heat to process temperature (for embossing this is typically just above the glass transition temperature (Tg).
  • Align stamp wafer with work piece (for embossing this is typically a polymer wafer or polymer coating on carrier wafer).
  • Align wafers.
  • Apply force for defined time.
  • Cool (using nitrogen) to defined de-emboss temperature (typically just below Tg).
  • Separate (de-emboss) wafers – for this process the chamber is vented and pressurised to 2 Bar absolute. This enables the wafers to be secured via vacuum chucks. This in-situ de-embossing is an optional extra and requires the inclusion of vacuum chucks. An alternative de-emboss option is a separate ex-situ tool.
  • Vent to atmosphere, open lid and remove embossed wafer.

The tool can be operated with a wide range of polymers. The maximum emboss area varies depending on the physical properties of the particular polymer being used.

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